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Visa Signs Agreement with Monitise to Expand Delivery of Financial Services

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Visa has signed a new commercial agreement with Monitise to expand delivery of mobile financial services to banked Visa account holders in conjunction with Visa’s financial institution partners.  Monitise’s expertise in customizing mobile applications for a broad range of phone models and operating systems enables Visa to virtualize existing Visa accounts on mobile phones and offer Visa account holders globally a new array of payment types.

 

One key focus of this alliance is the introduction of new mobile services to existing Visa account holders outside the U.S. that enable electronic payments on the go to meet consumers’ daily needs including mobile top-up, utility payments, and transit ticketing.

 

In addition, Monitise and Visa will launch a mobile banking solution in the U.S. for clients of Visa DPS, Visa’s debit and prepaid processing platform. This new service is designed to enable Visa clients and processing partners in the U.S. to quickly and efficiently offer their customers a suite of services, such as mobile payments, person-to-person payments, mobile transaction alerts and mobile marketing offers.

 

About Monitise:
Monitise plc (LSE: MONI.L), is a global leader in Mobile Money solutions, with the proven technology and expertise to enable financial institutions and other service providers to offer a wide range of mobile banking and payments services to their customers in both developed and developing territories.

Freescale Introduces Smart Automotive Microcontroller That Cuts Chip-Count

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Freescale Semiconductor has introduced the first single-chip device in its S12 MagniV mixed-signal microcontroller (MCU) family, the S12VR64. The device is designed for use in DC motors for automotive window lift and sunroof applications connected to local interconnect network (LIN) automotive body networks.

 

“We are leveraging our automotive semiconductor leadership and proven process technology expertise to create a more efficient solution for networked automotive applications”

 

The S12VR64 MCU is based on Freescale’s revolutionary LL18UHV technology (announced in October 2010) that enables extensive analog integration on the MCU so developers can connect high-voltage signals and power supplies directly to the MCU in their automotive designs, helping save board space, increase system quality and reduce complexity.

 

Traditionally, automotive electronic designs have required multiple devices: some created with a high-voltage process to connect to the battery and power actuator outputs, as well as MCUs created with a low-voltage digital logic process. This poses a challenge when the end application has space limitations. The S12VR64 MCU combines the different devices required for relay-driven electric motor control, including the LIN physical layers, voltage regulators and low- and high-side drivers, into one device.

 

This level of integration is accomplished via the LL18UHV technology, which uses Freescale’s proven, low-leakage 0.18 micron (LL18) fabrication process to integrate 40V analog, non-volatile memory (NVM) and digital logic on a single piece of silicon. The result is a compact and cost-effective solution that does what it takes up to four chips to accomplish in current designs. Fewer components increase overall quality, allow customers to create a smaller board and ultimately reduce the weight of the automobile.

 

“We are leveraging our automotive semiconductor leadership and proven process technology expertise to create a more efficient solution for networked automotive applications,” said Reza Kazerounian, senior vice president and general manager of Freescale’s Microcontroller Solutions Group. “The S12VR64 mixed-signal MCU is the first device based on LL18UHV technology, and we’ll continue to add products to our S12 MagniV family that offer the right levels of precision and intelligence for a range of motor control and lighting applications in body electronics and other areas of the car.”

 

The S12 MagniV family leverages the proven and well-supported S12 16-bit MCU, enabling software compatibility and tool reuse across a broad range of applications. Family members include:

 

  • New S12VR64 mixed-signal MCU: Single-chip device based on LL18UHV technology that allows the integration of high-voltage analog, NVM and digital logic on one piece of silicon. This device offers the smallest footprint in the family.
  • Existing system-in-package (SiP) solutions (MM912F634, MM912G634, MM912H634): These devices combine an S12 MCU and a SMARTMOS analog control IC, fabricated in two separate processes, in a single package. These SiP devices are ideal for customers who need dual-die solutions for applications in which high current is required.

 

Freescale intends to expand the S12 MagniV family to include a full range of AEC-Q100 qualified products that integrate an MCU, automotive voltage regulators, LIN and CAN physical layers, motor drivers and more in either single-chip or dual-die form, all in single-package solutions. The next parts planned for the S12 MagniV family are single-chip solutions for applications such as brushless DC motor control, LED lighting, stepper motor control, generic LIN slave nodes or a general-purpose MCU combined with high-voltage I/O.

 

The S12VR64 MCU is included in Freescale’s product longevity program, with assured supply for a minimum of 15 years. See www.freescale.com/productlongevity for details.

HTC Thunderbolt ADR6400L Mobile Handset

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The HTC Thunderbolt offers a few firsts for the growing Taiwanese-based smartphone manufacture. According to IHS iSuppli, there are the  key features.

 

  1. It is the first handset to offer long term evolution (LTE) connectivity over the wide 10MHz bandwdith Verizon spectrum in the 700Mhz space.
  2. It offers the first simultaneous voice and data over CDMA – putting CDMA-based 3G handsets finally on par with what WCDMA networks have enjoyed for the past few years.
  3. A level of complexity and feature sets not seen before in CDMA-based smartphones including Qualcomm’s first LTE solution, use of multiple RF transceivers, a massive 32GB microSD card (the highest cost item in the Bill of Materials (BOM)) and the second generation MSM8655 SnapDragon processor.

 

Next time you want to buy a phone, never say who is HTC. That company has emerged to become a big player in the industry. It is innovating and taking market shares from the likes of Nokia and Motorola. It is firing on all cylinders. From Indulge for MetroPCS to this new Thunderbolt, this device is solid. Recall that the first 4G in America in Sprint was made by HTC. So they are in the business of becoming firsts in many things now.

Fellowship and Scholar Competition – The Turing Centenary Research Project

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THE TURING CENTENARY RESEARCH PROJECT:
MIND, MECHANISM AND MATHEMATICS

Research Fellowship and Scholar Competition
http://www.mathcomp.leeds.ac.uk/turing2012/give-page.php?408
Submission deadline – December 16, 2011

 

More than any other figure, Turing has left a coherent scientific agenda
related to many of the ‘Big Questions’ concerning the relationship between
the human mind, mechanism in nature, and the mathematics required to
clarify and answer these questions. The very breadth and fundamental
nature of Turing’s impact makes the centenary celebration a hugely
opportune period in which to reassert the role of basic thinking in
relation to deep and intractable problems facing science.

 

 

‘The Turing Centenary Research Project – Mind, Mechanism and Mathematics’,
supported by a major grant from the John Templeton Foundation, arises from
the above-mentioned scientific agenda, and is aimed at researchers still
within ten years of receiving their Ph.D. The participants in the research
project will be the winners of the ‘Mind, Mechanism and Mathematics’
competition, designed to provide significant funding support for eight
young researchers. Five of the winners will become JTF ‘Turing Research
Fellows’ with an award of 75,000 UK pounds each; and awards of 45,000 UK
pounds will be for JTF ‘Turing Research Scholars’ in the 16 to 25
age-group.

 

 

The competition is organised in conjunction with the Turing Centenary
Celebration, to be held June 22-25, 2012, at the Manchester City Hall and
the University of Manchester. The award winners will be duly honoured on
the June 23, 2012 centenary of Turing’s birth.

Samsung Indulge 4G LTE – IHS iSuppli Tears It Down

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We received this from our email and sharing it in totality. It is about the new Samsung device that was designed for MetroPCS, a second tier network in US that operates in many urban areas and cities. You do not expect to see this phone or device in Nigeria because it is locked.

 

Samsung and MetroPCS hope that its first Android-based long term evolution (LTE) smartphone will have customers Indulging in all the new features it offers.

 

The Samsung Indulge is designed and priced very much as a second tier smartphone with lower overall cost than the leading handsets in the 4G/LTE market.

 

Given the differences in price between this lower priced handset versus the mainstream high-profile handsets, IHS iSuppli’s Teardown Analysis Service wanted to find out what these differences are inside the Indulge.

 

What we found inside is a home-grown Samsung CMC22000 baseband processor that works in conjunction with the discrete Samsung Apps processor and a Qualcomm QSC6075 tri band CDMA baseband chip. Samsung elected to use their own silicon and design in the LTE Indulge in order to cut down on the price of the device.

 

We also determined the complete component count of the Indulge that is on par with other LTE handsets that we have examined. But we also have the complete Bill of Materials (BOM) of the device, right down to every frame, resistor, component and screw with a price tagged on all of them.