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Google Wallet – Creativing New Opportunities For Citi, NXP, Sprint, Mastercard and First Data

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Google launched its ‘Google Wallet’ that will become the future payment engine. This will surely make Android phones more popular in the near future. Immediately, NXP came out and told the world that it is its chip and technology that are powering this hot mobile payment idea. In the U.S., Google and the hosts of First Data, Mastercard, Citi and  Sprint plan to get this Wallet into the market before the end of summer. This product will offer newer options with Citi getting a good one through its PayPass  Citi Mastercard brand. It will also work for the Google prepaid card.

 

The telecommunication company, Sprint, gets into the loop simply because the Nexus S 4G will run on Sprint Network and the first release of the Wallet will be on Sprint.

 

Have you counted how one product is creating opportunities for a bank, ICT firm, card company, telecommunication company? And yes, the chip supplier. There are many other companies that are behind this vision through supply chain, distribution, marketing and so on. That is what technology does – it could change an economy.

 

The Wallet will be powered by of one the hottest technologies right now. The Near Field Communication (NFC). That means all you need is to tap your phone on the PayPass terminal and that is all for making a payment. By tapping the phone on the approved and enabled terminal, you have paid and checkout is completed for your transaction in a supermarket, mall, etc. The days of credit card swipe for payment could  be coming close to becoming  history.

 

We are fascinated that NXP could produce this technology. In a company statement after the launch, they stated thus:

 

With NXP’s secure contactless NFC solution, consumers can simply wave their phones over intelligent surfaces to pay for goods, apply a discount coupon, or receive loyalty points

 

NXP has been moving fast into this domain. Recently, it has started developing varieties of Android based devices with medical applications. If this turns out to be true since Google did not confirm, it simply means that NXP NFC business unit could be really hot in coming quarters. Google Wallet is expected to bulldoze itself into the top of the market. One hopes that Square will not put itself for sale immediately.

 

Nigeria can see what technology does. It creates great opportunities. We think now is the time to create that environment to enable tech companies to succeed. They can help expand our GDP and diversify our economy away from minerals and hydrocarbon.

 

The Web Redesign: Evolution of Platform-Based Advertising

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Innovation is taking place in the internet, daily. Disruptions are happening and a new order is being formed. Industrial age companies continue to adapt, even as new firms redesign the structure of commerce and industry.

 

Anywhere you look, from Facebook recent changes on email messaging to Twitter introduction of more feedbacks, the web is alive and healthy. But it is changing and becoming more fragmented. Interoperability exists only at the point of connections and networking, after that, everyone takes a different path. Today, the big web entities are creating their own structures.

 

Google’s Chrome is unique and very different from Microsoft’s Internet Explorer. The same applies to Opera, Mozilla’ Firefox and Apple’s Safari. It is amazing how building proprietary web platforms around products have become a competitive strategy. While Facebook lives on the web, most of its contents reside within its boundaries. Search engines are not happy about that.

 

That old cohesive internet platform has given way to fragmentation with more proprietary ‘gateways’. We have seen new mobile devices that are connecting us to the web.  The transformation is so much that reliable assessment of internet hits could be challenging. It is common to see statistics that are off by millions from different companies for one site, within the same timeframe. Indeed, no one can blame them because they can measure based on their understanding of the gateways.

 

So, can a marketing director decide to buy ads which can be delivered to those that use iPhone to access the web? The ad will be web-based but can only be shown to users who access the web via iPhone. Going to that platform-based advertising will open opportunities to target customers not just by location, but by the device they use to access the web. What if I want Facebook to show my ads only to those that are visiting the site via Windows operating system? My product runs only on Windows and there is no reason to waste ad buys on Linux, Mac and Unix users.

 

We are already witnessing some of these innovations, albeit at infancy stage. It could result to higher efficiency in ad delivery, though cost of ads will increase. Previously, an ad buy in Google could serve most of the web. Today, you need to have different versions for Facebook, Twitter, and then Google. Of course, there are other channels. Twitter cannot be used in Facebook because the latter has built its own platform. Google is being cut-off by some other big players.  Proprietary platforms make it difficult for Google to have that speed to push ad since they must first receive ‘permissions’ from owners of the platforms before their ads are hosted. And most are not open to that. So, everyone has to develop and nurture its platform, driving more innovations. The whole constructs of network effects where the more the users, the better the value of the web solutions is a reflection of the advertising model.

 

In conclusion, as the web fragments on the platform bases, the ways businesses reach consumers must get creative. The proliferation and uniqueness of platforms provide an opportunity to target the right customer even at a very good budget. Instead of throwing ads into the deep ocean of the web, platforms can help deliver them, efficiently. After all, it does not make much sense to show Mac downloads ads to someone surfing the web with Windows.

 

Originally published at IGI Global

Nigeria Android Developers – The Next Area is Near Field Communication, The Technology Behind Google Wallet

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It has a forum, NFC Forum, and it is becoming very important. Google adopted it for its Google Wallet – an Android based mobile payment system.

 

Google is a principal member of this forum:

 

Google has joined the NFC Forum as one of the principal members. This member list includes some top companies in the mobile world such as Motorola, AT&T, LG and others. Intel recently just raised their level to the same Principal Level that Google and the others are at. This comes right after Google partners with Mastercard and Citigroup for NFC payments.

 

So what is NFC? This is what Wikipedia has on this entry

 

Near field communication, or NFC, is a set of short-range wireless technologies, typically requiring a distance of 4 cm or less. NFC operates at 13.56 MHz and at rates ranging from 106 kbit/s to 848 kbit/s. NFC always involves an initiator and a target; the initiator actively generates an RF field that can power a passive target. This enables NFC targets to take very simple form factors such as tags, stickers, key fobs, or cards that do not require batteries. NFC peer-to-peer communication is of course possible, where both devices are powered. According to the NFC Forum, the three main uses of NFC currently are “sharing, pairing, and transaction.”  Global companies are interested in NFC’s ability to provide pervasive marketing, simplify processes, and facilitate contactless payment for goods.

 

 

So when is NFC coming into the Nigerian developer circle? This is actually the tool that will reinvent the whole model of supermarket operation in the nation. What Good has done in Google Wallet is the next phase of mobile payment.  The first company that begins that integration could see major buy-in from foreign companies. Google enough, Android has a very deep documentation on how to code for NFC. Yet, you still need the NFC chips like the ones supplied by NXP to develop and create physical products on this technology.

Wapi Discount Provides Local Free Sales Promotions

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WapiDiscount is an Android mobile application providing sales promotions and discounts in your locality for free. Features include adding promotions seen, informing friends, rating promotions and reporting abuse for fake promotions.

 

Current applications under WapiGroup are; WapiRestaurant – Mobile Restaurant locator app, Lea – Maternal Information provider mobile app and BillTally – A bugdet manager mobile app, WapiDiscount – Discount locating mobile app.

 

It has been developed to serve teenagers, students and working class people due to their strong interest in knowing where to get cheap prices for products and services. The goal? Leverage technology  to meet the needs of users to know information on current promotions and enable them to add promotions information they come across.

Circuit Designers And Builders: You Need To Understand IC Packages

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Integrated circuits (ICs) are etched into tiny silicon chips. ICs may be part of larger electronic circuits or they may be a complete system by themselves. These components are packaged in ceramic, plastic, leadless or glass.

 

The sizes of the packages have assigned names and specifications. Often, we finish design with a particular IC without considering the type of packages available for such IC and the problem of soldering or placing the component shows up.

 

This is a common problem among hobbyists and students. In order to avoid this in your next project, try and check for the package type before you move on.

 

The following are the assigned names of some packages with their photos;

CBGA – Ceramic Ball Grid Array

CCGA – Ceramic Column Grid Array

CerDIP – Ceramic Dual-in-Line Package

CerPack – Ceramic Package

CLCC – Ceramic Leadless Chip Carrier

CLCC – Ceramic Leadless Chip Carrier

PQFP – Plastic Quad Flat Pack

PSOP – Power Small Outline Package

QFN – Quad Flat No Leads Package

QSOP – Quarter Size Outline Package

SBDIP – Sidebraze Dual-in-Line Package

SC-70 – Small Outline Transistor

SIP – Single-In-Line Package

CQFP – Ceramic Quad Flat Pack

SOIC – Small Outline IC Package

D2PAK or DDPAK – Dou-ble Decawatt Package

D3PAK – Decawatt Package 3

SOJ – Small Outline J-Lead Package

SOT-23 – Small Outline Transistor

DFN – Dual Flat No Leads Package

SOT-23 – Small Outline Transistor

DPAK – Decawatt Package

SSOP – Shrink Small Outline Package

TDFN – Thin Dual Flat No Leads Package

TFBGA – Thin Fine-Pitch Ball Grid Array

TQFN – Thin Quad Flat No Leads Package

TQFP – Thin Quad Flat Pack

TSOP – Thin Small Outline Package

TSSOP – Thin Shrink Small Outline Package

FBGA – Fine-Pitch Ball Grid Array

UTDFN – Ultra Thin Dual Flat No Leads Package

UTQFN – Ultra Thin Quad Flat No Leads Package

VFBGA – Very Thin Fine-Pitch Ball Grid Array

VSOP – Very Small Outline Package

XDFN – Extreme Thin Dual Flat No Leads Package

XQFN – Extreme Thin Quad Flat No Leads Package

JLCC – J-Leaded Ceramic Chip Carrier

LFBGA – Low Profile Fine-Pitch Ball Grid Array

LGA – Land Grid Array

LQFP – Low-Profile Quad Flat Package

MLP – Micro Leadframe Package

MQFP – Metric Quad Flat Package

MSOP – Micro Small Outline Package

PBGA – Plastic Ball Grid Array

PDIP – Plastic Dual-in-Line Package

PLCC – Plastic Leaded Chip Carrier

PPGA – Plastic Pin Grid Array

PQFN – Power Quad Flat No Leads Package