Integrated circuits (ICs) are etched into tiny silicon chips. ICs may be part of larger electronic circuits or they may be a complete system by themselves. These components are packaged in ceramic, plastic, leadless or glass.
The sizes of the packages have assigned names and specifications. Often, we finish design with a particular IC without considering the type of packages available for such IC and the problem of soldering or placing the component shows up.
This is a common problem among hobbyists and students. In order to avoid this in your next project, try and check for the package type before you move on.
The following are the assigned names of some packages with their photos;
CBGAÂ – Ceramic Ball Grid Array
CCGAÂ – Ceramic Column Grid Array
CerDIPÂ – Ceramic Dual-in-Line Package
CerPack – Ceramic Package
CLCCÂ – Ceramic Leadless Chip Carrier
CLCCÂ – Ceramic Leadless Chip Carrier
PQFPÂ – Plastic Quad Flat Pack
PSOPÂ – Power Small Outline Package
QFNÂ –Â Quad Flat No Leads Package
QSOPÂ –Â Quarter Size Outline Package
SBDIPÂ – Sidebraze Dual-in-Line Package
SC-70Â – Small Outline Transistor
SIPÂ – Single-In-Line Package
CQFPÂ – Ceramic Quad Flat Pack
SOICÂ – Small Outline IC Package
D2PAK or DDPAKÂ –Â Dou-ble Decawatt Package
D3PAKÂ –Â Decawatt Package 3
SOJÂ – Small Outline J-Lead Package
SOT-23Â – Small Outline Transistor
DFNÂ –Â Dual Flat No Leads Package
SOT-23Â – Small Outline Transistor
DPAKÂ –Â Decawatt Package
SSOPÂ – Shrink Small Outline Package
TDFN – Thin Dual Flat No Leads Package
TFBGA – Thin Fine-Pitch Ball Grid Array
TQFN – Thin Quad Flat No Leads Package
TQFPÂ – Thin Quad Flat Pack
TSOPÂ – Thin Small Outline Package
TSSOPÂ – Thin Shrink Small Outline Package
FBGAÂ –Â Fine-Pitch Ball Grid Array
UTDFNÂ – Ultra Thin Dual Flat No Leads Package
UTQFNÂ – Ultra Thin Quad Flat No Leads Package
VFBGA – Very Thin Fine-Pitch Ball Grid Array
VSOPÂ – Very Small Outline Package
XDFNÂ – Extreme Thin Dual Flat No Leads Package
XQFNÂ – Extreme Thin Quad Flat No Leads Package
JLCCÂ – J-Leaded Ceramic Chip Carrier
LFBGAÂ – Low Profile Fine-Pitch Ball Grid Array
LGAÂ – Land Grid Array
LQFPÂ – Low-Profile Quad Flat Package
MLPÂ – Micro Leadframe Package
MQFPÂ – Metric Quad Flat Package
MSOPÂ – Micro Small Outline Package
PBGA – Plastic Ball Grid Array
PDIPÂ – Plastic Dual-in-Line Package
PLCCÂ – Plastic Leaded Chip Carrier
PPGA – Plastic Pin Grid Array
PQFN – Power Quad Flat No Leads Package

