Integrated circuits (ICs) are etched into tiny silicon chips. ICs may be part of larger electronic circuits or they may be a complete system by themselves. These components are packaged in ceramic, plastic, leadless or glass.
The sizes of the packages have assigned names and specifications. Often, we finish design with a particular IC without considering the type of packages available for such IC and the problem of soldering or placing the component shows up.
This is a common problem among hobbyists and students. In order to avoid this in your next project, try and check for the package type before you move on.
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The following are the assigned names of some packages with their photos;
CBGA – Ceramic Ball Grid Array
CCGA – Ceramic Column Grid Array
CerDIP – Ceramic Dual-in-Line Package
CerPack – Ceramic Package
CLCC – Ceramic Leadless Chip Carrier
CLCC – Ceramic Leadless Chip Carrier
PQFP – Plastic Quad Flat Pack
PSOP – Power Small Outline Package
QFN – Quad Flat No Leads Package
QSOP – Quarter Size Outline Package
SBDIP – Sidebraze Dual-in-Line Package
SC-70 – Small Outline Transistor
SIP – Single-In-Line Package
CQFP – Ceramic Quad Flat Pack
SOIC – Small Outline IC Package
D2PAK or DDPAK – Dou-ble Decawatt Package
D3PAK – Decawatt Package 3
SOJ – Small Outline J-Lead Package
SOT-23 – Small Outline Transistor
DFN – Dual Flat No Leads Package
SOT-23 – Small Outline Transistor
DPAK – Decawatt Package
SSOP – Shrink Small Outline Package
TDFN – Thin Dual Flat No Leads Package
TFBGA – Thin Fine-Pitch Ball Grid Array
TQFN – Thin Quad Flat No Leads Package
TQFP – Thin Quad Flat Pack
TSOP – Thin Small Outline Package
TSSOP – Thin Shrink Small Outline Package
FBGA – Fine-Pitch Ball Grid Array
UTDFN – Ultra Thin Dual Flat No Leads Package
UTQFN – Ultra Thin Quad Flat No Leads Package
VFBGA – Very Thin Fine-Pitch Ball Grid Array
VSOP – Very Small Outline Package
XDFN – Extreme Thin Dual Flat No Leads Package
XQFN – Extreme Thin Quad Flat No Leads Package
JLCC – J-Leaded Ceramic Chip Carrier
LFBGA – Low Profile Fine-Pitch Ball Grid Array
LGA – Land Grid Array
LQFP – Low-Profile Quad Flat Package
MLP – Micro Leadframe Package
MQFP – Metric Quad Flat Package
MSOP – Micro Small Outline Package
PBGA – Plastic Ball Grid Array
PDIP – Plastic Dual-in-Line Package
PLCC – Plastic Leaded Chip Carrier
PPGA – Plastic Pin Grid Array
PQFN – Power Quad Flat No Leads Package